Category EN P13 Improving Heat Transfer in a Passive Liquid Cooling System

Abstract Computer processors are continually getting faster, and putting out more

heat. The increased heat has the potential to damage the processor and

other components, which can be extremely costly. The traditional way to

combat overheating is a heatsink and fan. Heatsinks are designed to be

contiguous with the surface of processors, increasing the surface area,

which increases heat transfer.



In phase 1 of this project, it was found that a brass, water filled heatsink

that utilized natural convection cooled a CPU better than a standard

heatsink and fan. The goal of this project was to increase the efficacy of

the phase 1 heatsink. A new design was made for the phase 2 heatsink

that consisted of a water filled brass box with 2 concentric coils of copper

tubing that are open to the air.



Both the phase 1 and 2 heatsinks were tested by running a CPU stress

tester, and a temperature monitoring software that recorded the

processor's temperature every 5 seconds simultaneously. A third

program, made specifically for this project, was used to average the

temperatures recorded, and find the difference between the initial

temperature and the average temperature.



In a facility with 100 computers, 3000 KWH of electricity consumed solely

by CPU fans. If that facility adopted the phase 2 heatsink, the 3000 KWH

would be cut from the electricity bill, and decrease the drain on the natural

resources used to produce the energy.

Bibliography Bejan, A (2004). Convection heat transfer. Hoboken, NJ: John Wiley &

Sons.



Janna, W.S. (2000). Engineering heat transfer. Boca Raton, FL: CRC Press

LLC.



Shah, & Subarau, & Mashelkar, R. K., E. C., R. A. (1988). Heat transfer

equipment design. Boca Raton, FL: Hemisphere Publishing Corporation.
First Previous Next Last